Descrizione
Extruded aluminum heat sink for passive dissipation of heat from power semiconductors and integrated circuits. It is suitable for mounting on a flat mating surface using thermal paste or thermally conductive adhesive according to application requirements.
Technical specifications
Material: aluminum
Dimensions: 100 × 61 × 5.5 mm
Number of fins: 17
Design: extruded profile
Intended use: passive heat sink for electronic components
Functions and features
Increased surface area due to finning for more efficient heat transfer to ambient air
Suitable for cooling ICs, memories, chipsets and other components with planar contact
Can be installed by adhesive (thermally conductive adhesive) or mechanically depending on device construction
For proper operation it is recommended to use a thermally conductive material between the component and the heat sink
Ideal for
Cooling integrated circuits and power elements in compact devices
Electronic modules, power sections, control units and prototype constructions
Repairs and modifications where improved heat dissipation from a chip or package is required
Package contents
1 pcs aluminum heat sink 100 × 61 × 5.5 mm
Why choose this product
Standard aluminum heat sink with defined dimensions for easy integration into designs
Finned profile for passive cooling without the need for a fan
Suitable for a wide range of electronic applications requiring heat dissipation
Installation and operation instructions
Before assembly, clean mating surfaces of dirt and grease
To reduce thermal resistance use thermal paste or thermally conductive adhesive
Verify mechanical compatibility with surrounding components and airflow in the device
Safety warnings
During operation the heat sink may reach elevated temperatures; ensure protection against contact according to device design
When using thermally conductive adhesives follow the manufacturer’s instructions and provide adequate ventilation during application
Recensioni
Ancora non ci sono recensioni.