Descrizione
Passive aluminum heat sink is designed to dissipate heat from power semiconductors and other electronic components. It is used to stabilize operating temperature and increase operational reliability under both continuous and pulsed loads.
Technical specifications
Type: passive cooler
Material: aluminum
Dimensions: 300 x 25 x 12 mm
Design: profile with longitudinal ribs
Mounting: mechanical attachment according to device design
Functions and features
Increased surface area for natural airflow thanks to ribbing
Suitable for heat dissipation from power elements and modules in compact assemblies
Possibility to adjust the length and mounting holes according to application requirements
Design suitable for mounting on a flat surface
Ideal for
LED applications and LED modules with higher thermal output
Voltage stabilizers, power transistors, rectifiers and DC/DC converters
Industrial controllers and power supplies
Prototyping and custom mechanical design of electronics
Package contents
Aluminum heatsink 300 x 25 x 12 mm
Why choose this product?
Simple passive cooling without noise and without the need for a fan power supply
Standard profile suitable for a wide range of power applications
Dimensionally suitable for installation in cabinets and assemblies with limited space
Installation and operating instructions
To achieve good thermal contact, use a flat contact surface and suitable thermally conductive material.
During assembly, ensure uniform pressure forces to avoid deformation of the components or the heat sink.
Adjust the location and orientation of the cooler to the airflow in the device; ambient temperature and ventilation are crucial for passive cooling.
Safety notice
The cooler can reach high temperatures during operation; there is a risk of burns when handling it after loading.
If the cooler is in electrical contact with live parts, it is necessary to ensure adequate insulation and comply with the requirements for safe distances in the equipment.
Recensioni
Ancora non ci sono recensioni.