Descrizione
Double-sided thermally conductive adhesive tape with a thickness of 0.2 mm is designed for heat transfer between a heat source (e.g. LED module, power element, memory module) and a heat sink or metal chassis. The tape improves contact between surfaces, helps reduce the thermal resistance of the joint, and at the same time allows mechanical fastening without the use of screws or thermal pastes.
Technical specifications
Type: double-sided thermal conductive adhesive tape
Thickness: 0.2mm
Length: 5m or 25m (depending on variant)
Width: 10mm, 20mm, 30mm, 40mm, 50mm, 80mm (depending on the variant, other widths possible on request)
Thermal conductivity: 1.2 W/mK
Operating temperature (min.): -20 °C
Operating temperature (max.): 120 °C
Temperature resistance (short term): up to 180 °C
Electrical properties: electrically insulating
Functions and features
Provides simultaneous heat transfer and strong adhesion between two surfaces
Fills minor unevenness between surfaces and improves fit
Suitable for LED and heat sink applications where clean and fast assembly is required
Electrically insulating layer to separate the component from metal parts
Possibility of processing into the desired shape (cutting, punching) according to production technology
Ideal for
Fixing and cooling LED modules and LED strips on aluminum profiles
Bonding small heat sinks to integrated circuits and power components
Thermal bonding of components to a metal chassis in electronics and appliances
Service and prototype work where quick assembly without mechanical fasteners is required
Package contents
1× double-sided thermally conductive adhesive tape (thickness 0.2 mm) (width and length depending on the variant)
Why choose this product?
Combines thermal transfer and bonding in one step
Allows clean assembly without thermal paste and without screws
Parameters suitable for common cooling applications in electronics
Electrical insulation helps with safe separation from conductive components
Installation and operating instructions
Before application, clean and degrease both bonded surfaces to ensure stable adhesion and low thermal resistance of the joint.
Press the tape evenly over the entire surface, avoiding air bubbles.
For maximum heat transfer efficiency, use the largest possible contact area and minimize layer thickness within design capabilities.
When disassembling, proceed with caution to avoid damaging the components or the finish of the heatsink.
Recensioni
Ancora non ci sono recensioni.